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January 2018 post

Global Force Symposium & Exposition

AIM USA LLC is exhibiting at the AU SA ILW Global Force Symposium & Exposition in Huntsville, AL in March 2018. Come and visit AIM USA LLC in Booth 205 at the AUSA ILW Global Force Symposium & Exposition, being held at the Von Braun Center in Huntsville, AL from March 26th to the 28th, 2018.  AIM USA LLC will be showcasing our latest avionics product offerings for US Army platforms.

 

AIM USA AUSA Global Force Symposium & ExpositionTradeshow 2018

 

November 2017 editorialfeatures

Rugged and Ready with PMC

AIM has launched 2 variants of its “rugged and ready” PMC modules – the AMC1553-x and AMCE429-x – and both are conduction-cooled PMC cards with low power consumption for rugged, embedded applications…
Rugged and Ready with PMC
September 2017 post

Flexibility first with Ethernet!

Please find attached AIM’s latest Editorial Feature published in Aerospace Testing Magazine, September Issue 2017!Flexibility First With Ethernet
September 2017 editorialfeatures

Flexibility first with Ethernet

Testing solutions using Ethernet based data communications are simple in concept, but variations in upper layers add complications, and enabling special features requires flexibility….
Flexibility first with Ethernet
September 2017 post

Rugged and Ready with PMC

AIM’s PMC modules target MIL-STD-1553/ARINC429 Embedded Applications‘Rugged and Ready with PMC’
August 2017 pressreleases

What’s the Protocol

AIM’s Ethernet based interface
family now includes a new
member with Mixed Protocol
support, combining MIL-STD-1553
and ARINC429 data bus test
and simulation capabilities in
1 ANET device.
What’s the Protocol
June 2017 post

Triple Speed PCIe module for AFDX®/ARINC664P7

AIM has released the APE-FDX-2, AFDX®/ARINC664P7 PCI Express test and simulation interface module, being the first of the new third generation and successor to the formidable API-FDX-2 module…On Track with Express
June 2017 pressreleases

On track with Express for triple speed AFDX®/ARINC664P7 Test & Simulation

AIM has released the APE-FDX-2, AFDX/ARINC664P7
PCI Express test and simulation interface module
(PCIe 2.0 x1), being the first of the new third generation
and successor to the formidable API-FDX-2
(PCI/PCI-X) module.
On track with Express for triple speed AFDX®/ARINC664P7 Test & Simulation
June 2017 pressreleases

Rugged and Ready with PMC

AIM’s PMC modules target MIL-STD-1553/ARINC429 Embedded Applications AIM GmbH has introduced 2 variants of its PMC
modules, the AMCE1553-x and AMCE429-x, being
conduction cooled PMC cards designed specifically
for rugged, embedded MIL-STD-1553/MIL-STD-1760
and ARINC429 applications.
Rugged and Ready with PMC
March 2017 editorialfeatures

On Track with Express

Recently AIM released the APE-FDX-2, AFDX/ARINC664P7 PCI Express test and simulation interface module (PCIe 2.0 x1), which is “on track with Express” to be the successor of the formidable API-FDX-2 (PCI/PCI-X) module….
On Track with Express
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